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Electronic packaging graphite boat

产品详情

Product Name: Electronic Packaging Graphite Tray Abstract

The electronic packaging graphite boats are mainly made of high-purity graphite materials. These materials are renowned for their excellent thermal conductivity, chemical stability, and high-temperature resistance. Through precise processing techniques, these graphite boats can be manufactured into complex boat-shaped structures, ensuring uniform heating and stable performance during semiconductor packaging processes. It is a reliable manufacturer of electronic packaging graphite boats in China, dedicated to producing durable semiconductor packaging graphite boats. The products always maintain high quality, excellent cost-effectiveness, and can be customized according to different production needs of customers.
Product Details
The electronic packaging graphite carrier can be manufactured in various sizes and carrier designs, and can be adjusted according to different chip dimensions and packaging requirements to meet various production needs. It also has very precise size control and excellent surface finish. The surface of the graphite carrier is extremely smooth, free of impurities and cracks, ensuring that the chips will not be contaminated during the high-temperature packaging process. The scientific and reasonable design of the carrier structure ensures that the chips are heated uniformly during the packaging process, thereby improving packaging yield and product reliability.
Product Parameters (Specifications)
Parameter Categories

Specific parameters

Explanation

Manufacturing process

CNC machining
Precision grinding Surface treatment

Ensure high precision and surface quality
Equipment / Machinery

CNC numerical control machine tools
Precision grinding machine
Cleaning equipment

Advanced processing equipment ensures quality.
Materials

High-purity graphite
Carbon content > 99.5%

Excellent thermal conductivity and chemical stability
Surface treatment

High-temperature purification
Coating treatment

Improve surface cleanliness and corrosion resistance
Industry

Semiconductor industry
Electronic packaging

Suitable for various packaging processes
Product features and applications
With the rapid development of the semiconductor industry, the requirements for packaging accuracy and reliability are increasing day by day. The design of electronic packaging graphite boats has become more sophisticated, and the material performance is more outstanding. We are a reputable Chinese manufacturer dedicated to producing precise, sturdy, and high-temperature-resistant electronic packaging graphite boats. We have a strict quality control system and adopt the most advanced graphite processing technology. These graphite boats comply with international industry standards and meet customers' demands for high-quality packaging solutions.
Core advantages
High-purity materials
Using graphite materials with a purity of over 99.5%, it ensures excellent thermal conductivity and chemical stability, reducing the risk of contamination of the chip by impurities.
Precise boat-shaped design
Optimize the boat-shaped structure according to different chip specifications to ensure uniform heating of the chips during the packaging process and improve the packaging yield.
High-temperature resistance performance
It can operate stably at temperatures up to 1500°C and can meet the requirements of various high-temperature packaging processes without undergoing deformation or performance degradation. Chemical stability

Excellent antioxidant and corrosion resistance capabilities, allowing for long-term use in various chemical environments without affecting performance.
High dimensional accuracy
±0.05mm dimensional accuracy ensures a perfect fit with the packaging equipment, enhancing production efficiency and product quality.
Customizable
Various specifications and boat-shaped designs can be customized according to the special needs of customers, meeting different packaging process requirements.
Technical capabilities details
Processing capacity
CNC numerical control processing: High-precision three-dimensional curved surface processing
Precision grinding: Surface finish can reach Ra 0.8 μm
Electrical discharge machining: Precise shaping of complex boat-shaped structures
Laser processing: High-precision microstructure fabrication
Material properties
Carbon content: > 99.5%
Density: 1.7 - 1.9 g/cm³
Thermal conductivity: > 100 W/m·K
Coefficient of thermal expansion: < 5 × 10⁻⁶/K
Resistivity: < 10 μΩ·m
Surface treatment

High-temperature purification treatment: Removal of surface impurities
Coating treatment: Enhancing antioxidant capacity
Precision polishing: Enhancing surface smoothness
Ultrasonic cleaning: Ensure cleanliness
Tolerance standard
Dimension tolerance: ±0.05mm
Shape and position tolerance: ±0.02mm
Surface roughness: Ra 0.8 μm
Flatness: < 0.03mm
Delivery period

Sample: 3-5 weeks
Batch orders: Determined based on the order quantity, usually within 4 to 8 weeks.
Quality standards

ISO 9001:2015 Quality Management System
IATF 16949 Automotive Industry Quality Management System
SGS RoHS/REACH Environmental Certification
Application domain presentation
Semiconductor integrated circuit packaging
The packaging process for various IC chips ensures precise temperature control and stable supporting function.
Power device packaging
High-temperature packaging suitable for power semiconductor devices, demonstrating excellent heat conduction and temperature resistance performance.
LED packaging
For the packaging process of LED chips, it provides uniform heat dissipation and precise positioning.
MEMS device packaging
Suitable for the packaging of micro-electromechanical system devices, meeting the requirements of high-precision positioning and support.
Radio frequency device packaging
For the packaging of RF chips, to ensure excellent electrical performance and thermal management.
Optoelectronic device packaging
Suitable for the packaging of optical devices such as lasers and photodetectors, providing precise optical alignment. Frequently Asked Questions Answered

Q1: What is the main material of the electronic packaging graphite boat? A1: We use high-purity graphite material, with a carbon content of over 99.5%, to ensure excellent thermal conductivity and chemical stability.
Q2: What is the working temperature range of the graphite boat? A2: Our graphite boat can operate stably within a temperature range of -50°C to 1500°C, fully meeting the requirements of various semiconductor packaging processes.
Q3: Can customized graphite boat products be provided? A3: Yes, we can customize various specifications and boat design types according to the specific needs of our customers, including services such as drawing processing or sample production.
Q4: How accurate is the size of the product and what is the surface quality? A4: The size accuracy of our products can reach ±0.05mm, and the surface roughness is Ra 0.8μm, ensuring a perfect fit with the packaging equipment.

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