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Graphite pelletizing tooling

产品详情

Product Name: Graphite Insert Assembly Tooling System
Summary Overview
The graphite ball planting tooling system is a high-precision tooling solution specifically developed for semiconductor packaging, electronic manufacturing, and precision instrument industries. The system uses high-purity graphite materials combined with precise processing techniques to ensure the stability and reliability of the ball planting operation. The tooling design fully considers the special requirements of semiconductor packaging, excelling in aspects such as material purity, surface flatness, ball planting accuracy, and high-temperature resistance, and can meet the strict standards of various advanced packaging processes. As a leading semiconductor tooling manufacturer in China, we are committed to providing high-quality, customized ball planting tooling solutions for global customers, ensuring the dual improvement of production efficiency and product quality.
Product Details
The graphite ball placement tooling system is developed by selecting high-purity graphite materials, combined with precise machining and surface treatment technologies, to create tooling products that meet the requirements of the semiconductor industry. The surface of the tooling has undergone special treatment to ensure extremely high flatness and cleanliness, while maintaining stable physical properties in high-temperature environments. The system design fully considers the actual production needs, and the optimized structure of the tooling facilitates operation and maintenance, effectively enhancing the efficiency and yield of the ball placement process.
Graphite materials possess excellent thermal conductivity and corrosion resistance, and can maintain dimensional stability during high-temperature welding without releasing harmful impurity ions to the chips. The special surface treatment process of the tooling ensures good wetting with the solder balls, while avoiding the occurrence of oxidation and contamination issues.
Product Parameter Specification Table
Parameter Categories

Specific specifications

Technical indicators

Basic Materials

High-purity graphite

Purity ≥ 99.5%, Ash content ≤ 0.5%
Density

1.7 - 1.9 grams per cubic centimeter

±0.05 g/cm³
Surface flatness

Precision grinding surface

Flatness ≤ 0.002 mm/m
Surface roughness

Super-smooth treatment

Ra ≤ 0.4 μm
Working temperature

High-temperature resistance range

-40°C to 300°C
Ball placement accuracy

Ball diameter positioning accuracy

±0.025 mm
Ball spacing accuracy

Relative position accuracy

±0.05 mm
Material purity

Content of metallic impurities

Fe ≤ 10 ppm, Cu ≤ 5 ppm
Coefficient of thermal expansion

CTE (25-200°C)

4-6 × 10⁻⁶/K

Compressive strength

At 20 degrees Celsius

≥ 35 MPa

Electrical resistivity

At 25°C

8 - 15 μΩ·m
Processing equipment

Five-axis CNC machine tool

Positioning accuracy: ±0.01 mm
Surface treatment

Vacuum heat treatment

Strain-relief annealing
Size specification

Standard specification

100×100×10 mm to 300×300×50 mm
Customization capability

Non-standard specifications

Can be customized according to the drawings
Product features and applications
Core features
The purity of the material is extremely high. The graphite material has a purity of over 99.5%. The content of metal impurities is strictly controlled. During the semiconductor packaging process, no ion contamination will be released, ensuring the long-term reliability of the chip.
2. Excellent surface flatness: Utilizing precise grinding and polishing techniques, the surface flatness reaches 0.002 mm/m, and the surface roughness Ra is ≤ 0.4 μm, ensuring uniform contact with the chip and substrate.
3. The ball placement accuracy is high. The tooling design is combined with a high-precision positioning system. The diameter positioning accuracy of the balls reaches ±0.025 mm, and the spacing accuracy is ±0.05 mm, meeting the strict requirements of advanced packaging processes.
4. Excellent high-temperature resistance: The graphite material maintains stable mechanical properties and dimensional accuracy even at 300°C, making it suitable for various reflow soldering and high-temperature packaging processes.
5. Excellent thermal management graphite exhibits outstanding thermal conductivity, enabling rapid and uniform heat transfer, reducing thermal stress, and enhancing the reliability and yield of the package. Application scenario

This product is widely applied in the following fields:
Semiconductor packaging is used for the ball placement process of IC chips, ensuring that the solder balls are precisely placed on the chip pads. It is particularly suitable for high-density packaging such as BGA and CSP.
Microelectronic assembly provides high-precision ball placement support in the manufacturing process of various precision electronic components, and is applicable to ultra-small components such as 0402 and 0201.
Optoelectronic devices are used for encapsulating and ball-mounting of optoelectronic components such as LEDs and lasers, ensuring optical performance and thermal management performance.
MEMS devices are suitable for the packaging of micro-electromechanical system components and can meet the ball placement requirements with micrometer-level precision.
Power semiconductors are used for the packaging of power devices such as IGBT and power MOSFETs, ensuring reliability during high current flow.
Core advantages list
Material purity advantage
Ultra-high purity: The purity of the graphite material is ≥ 99.5%, and the content of metal impurities is extremely low (Fe ≤ 10 ppm, Cu ≤ 5 ppm)
Low exhaust rate: In a high-temperature vacuum environment, the exhaust rate is extremely low, and it will not contaminate the vacuum environment.
Chemical stability: Excellent anti-oxidation and anti-corrosion properties, suitable for use in various chemical environments.
Consistency: There is minimal performance variation between batches, ensuring highly consistent products.
Precision advantage
Micron-level accuracy: The surface flatness is controlled within 0.002 mm/m.
Super-smooth surface: Surface roughness Ra ≤ 0.4 μm, ensuring defect-free contact
High positioning accuracy: Ball placement positioning accuracy ±0.025 mm, meeting the requirements of high-density packaging.
Repeatability accuracy: Maintaining extremely high dimensional and positional repeatability in mass production
Thermal performance advantage
Wide temperature range operation: Can operate normally within the temperature range of -40°C to 300°C.
Low thermal expansion: Thermal expansion coefficient is 4 - 6 × 10⁻⁶/K, and it has good compatibility with silicon wafer materials.
High thermal conductivity: Excellent thermal conductivity, conducive to heat dissipation and thermal stress management
Thermal cycling stability: The size and performance remain stable after multiple thermal cycles.
Process compatibility
High compatibility: Excellent compatibility with various solder pastes and solder balls.
Process window width: Suitable for various reflow soldering temperature curves
Easy to clean: The surface is not prone to accumulate welding slag and contaminants, making it convenient for cleaning and maintenance.
Long service life: Has a long service period under normal usage conditions, with significant economic benefits.
Technical Capability Details
Material Control Capability
We have established a complete supply chain management system for graphite materials and have established long-term cooperative relationships with renowned graphite material suppliers both domestically and internationally. Before the materials enter the factory, they undergo strict inspections, including ICP-MS impurity analysis, XRF elemental analysis, Raman spectroscopy structural analysis, etc., to ensure that each batch of materials meets the standards for semiconductor applications. The material inventory is managed by classification, following the first-in-first-out principle to ensure the freshness of the materials.
Processing technology capabilities
Equipped with a complete set of processing equipment including five-axis CNC machines, high-precision surface grinders, and polishing machines, the processing accuracy can reach 0.01 mm. The processing process adopts wet processing and precision tools to ensure excellent surface quality. After processing, strict size inspection and appearance checks are carried out to ensure no scratches, pits, or other defects.
Surface treatment technology
The vacuum heat treatment process is adopted to eliminate processing stress and improve dimensional stability. The surface treatment includes various processes such as mechanical polishing, chemical polishing and plasma treatment, and the most suitable treatment method can be selected according to different application requirements. The treated surface can be controlled within a specific range to ensure good wetting with the solder paste.
Precision control capability
A precise detection system including three-coordinate measurement, profilometer, and roughness tester has been established to comprehensively monitor product quality. Statistical Process Control (SPC) is adopted for key dimensions and form tolerances to ensure the stability of the production process and the continuous improvement of the products. The detection environment is maintained at a constant temperature and humidity to ensure the accuracy and repeatability of the detection data.
Environmental adaptability
The product has passed environmental reliability tests such as high and low temperature shock, humidity cycling, and mechanical vibration, and is suitable for various harsh application environments. Particularly, in response to the characteristics of semiconductor packaging processes, a verification plan for rapid temperature changes and multiple thermal cycles has been designed to ensure the product's performance in actual production.
Application fields display
Semiconductor integrated circuit packaging
The graphite ball placement tooling plays a crucial role in integrated circuit packaging, especially for high-density packaging technologies such as BGA (Ball Grid Array) and CSP (Chip Scale Packaging). The high precision and thermal management performance of the tooling ensure that thousands of tiny spherical solder joints can be accurately placed and form reliable electrical and mechanical connections during the subsequent reflow soldering process. Our tooling has been successfully applied to multiple logic chip and memory chip packaging production lines.
Power semiconductor module
In the field of power electronics, power semiconductor modules such as IGBT and SiC devices have more stringent requirements for the assembly tools. The tools need to remain stable in high-temperature and high-current environments to ensure the long-term reliable operation of power devices. The excellent thermal conductivity and high-temperature resistance of graphite make it an ideal choice for power semiconductor packaging. Our tools have been widely used in the production of power modules in fields such as new energy vehicles, photovoltaic inverters, and industrial power supplies.
MEMS sensor packaging
Micro-electromechanical system (MEMS) devices such as accelerometers, gyroscopes, pressure sensors, etc., have extremely high requirements for packaging accuracy and cleanliness. The graphite ball placement tooling can provide micrometer-level precision control, ensuring that MEMS devices are not contaminated or damaged during the packaging process. The chemical stability and low exhaust rate characteristics of the tooling are particularly suitable for the packaging of MEMS devices with extremely high cleanliness requirements.
High-frequency/radio frequency device packaging
The applications of 5G communication and the Internet of Things have placed higher demands on the packaging of RF components. The graphite ball placement tooling, with its excellent dielectric properties and thermal management capabilities, can ensure that RF components maintain stable electrical performance in high-temperature environments. The surface flatness and precision control of the tooling help reduce signal loss and improve RF performance.
LED lighting devices
In the packaging of power LED lighting devices, heat dissipation is a key consideration. The high thermal conductivity and high-temperature resistance of the graphite ball placement tool can effectively solve the heat dissipation problem of LED devices and extend their lifespan. The tool is suitable for the ball placement process of high-power LED chips and ensures the performance and reliability of LED lighting products. Frequently Asked Questions Answered

Q1: Why was graphite material chosen for the wafer implant tooling? A1: Graphite material boasts extremely high purity, excellent thermal conductivity, and high-temperature resistance, and its chemical properties remain stable in semiconductor processes. Compared to other materials, graphite does not release harmful impurity ions to the chips, and it maintains dimensional stability in high-temperature environments. Therefore, it is an ideal material for semiconductor wafer implant tooling.
Q2: What are the specific values for the surface flatness and roughness of the workpiece? A2: The surface flatness of our graphite ball planting workpiece is controlled within 0.002 mm/m, and the surface roughness Ra is ≤ 0.4 μm. This extremely high surface flatness and smoothness ensures uniform contact with the chip and substrate, avoiding ball planting defects caused by uneven surfaces.
Q3: What is the accuracy of the ball planting? A3: The positioning accuracy of our tool for ball planting can reach ±0.025 mm, and the ball spacing accuracy is ±0.05 mm. This level of accuracy fully meets the requirements of current mainstream semiconductor packaging processes and can handle high-density and micro-spacing ball planting applications.
Q4: What is the maximum operating temperature of the tooling? A4: Our graphite ball placement tooling can operate normally within a temperature range of -40°C to 300°C. This temperature range covers all the key steps in the semiconductor packaging process, including reflow soldering and high-temperature storage processes.
Q5: Can customized workwear products be provided? A5: Yes, we can offer customized services based on the specific requirements of our clients. Clients can provide detailed drawings or samples, and we can manufacture various non-standard-sized workwear products. The minimum processing size can reach 0.5 mm, and the tolerance can be controlled within ±0.01 mm.
Q6: What is the service life and the number of times the workpiece tool can be reused? A6: Under normal usage and proper maintenance, our graphite ball planting workpiece tool can be reused more than 100 times. The actual service life depends on specific usage conditions, process parameters, and maintenance status. We recommend conducting regular surface inspections and performance tests to ensure the tool is in good condition.
Q7: How do you ensure the cleanliness and lack of contamination of the workpieces? A7: After the workpieces are processed, they undergo strict cleaning and surface treatment, including ultrasonic cleaning, deionized water rinsing, and high-temperature baking. The workpieces are packaged with anti-static and dust-proof packaging to ensure their cleanliness during transportation and storage. It is recommended that customers unpack and use the products in a cleanroom environment.
Q8: What are the resistivity and thermal conductivity of the tooling? A8: The resistivity of our graphite tooling is 8-15 μΩ·m (at 25°C), and the thermal conductivity is approximately 120-200 W/m·K. These parameters ensure a balanced performance in terms of electrical insulation and thermal management, making it suitable for various semiconductor packaging applications.

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